Skorpios Technologies provides details on Skorpios co-packaged optics at ACP2021


SHANGHAI, 28 October 2021 / PRNewswire / – Skorpios Technologies, Inc., an integrated silicon photonics company, presented details of its approach to co-packaged optics at the ACP2021 conference in Shanghai, China. This approach to providing optical interfaces directly at the box level for high speed digital interfaces uses Skorpios unique Tru-SiPh platform integrating lasers, modulators and other components on a polarization insensitive silicon photonics platform. This highly integrated photonic chip will provide 3.2 Tb / s FR4 optical interfaces and is small enough that 16 can be placed around an integrated circuit to provide 51.2 Tb / s as an interface to scale chip for the next generation of high bandwidth switches.

Skorpios’ silicon photonics platform integrates lasers, electro-absorption modulators (EAM), semiconductor optical amplifiers (S) A) and photodiodes (PD) in III-V compounds directly into silicon-based wafers. Electronics and optics can then be integrated, etched and tested at wafer scale. The laser materials are directly bonded to the silicon substrate, which greatly improves heat management and minimizes the size of the laser. Since all laser strip processing occurs after binding, multiple devices can be implemented on each implanted epitaxial layer and the laser power in the waveguide is optimized. Likewise, EAMs are constructed from other implanted epitaxies, reducing the size and complexity of modulator control.

The thick silicon platform used by Skorpios offers several advantages: low waveguide loss, low coupling loss, polarization insensitivity and high optical power handling. The multiplexing (Mux) and demultiplexing (DeMux) functions do not require adjustment. The entire platform is coated with silicon dioxide after fabrication, which means III-V devices and veneers are protected from the environment, eliminating the need for airtight packaging.

“It was exciting to present our 3.2 Tbps CPO design at this conference. Thanks to our design, we can integrate all the devices on a single small chip, including 16 lasers (plus 16 redundant), 32 EAM, 32 SOA, 32 PD, and 8 Mux and DeMux wavelength without tuning, for provide eight standard 400 Gb / s FR4 links, ”said Glenn li, Technical Director of Skorpios. “This product is an outstanding demonstration of the highly integrated heterogeneous silicon photonics possible with our platform.”

About Skorpios Technologies, Inc.

Skorpios is a semiconductor company that offers highly integrated products based on its proprietary, heterogeneous wafer-scale integration process. This new process leverages the existing silicon manufacturing ecosystem to enable high bandwidth interconnectivity at mature CMOS manufacturing costs. Skorpios unique platform can be used to meet a wide range of applications: high speed video, data and voice communications for networking, cloud computing, consumer, medical, etc. For more information visit www.skorpiosinc.com.

Press contact:
David huff
Senior Vice President, Sales and Marketing
Skorpios Technologies, Inc.
[email protected]

SOURCE Skorpios Technologies, Inc.

Related links

www.skorpiosinc.com


Source link

Previous Hardware Manufacturer Seeks to Build $ 1.7 Million Facility in Rockland Business Park Area
Next China extracts more coal for energy needs, despite climate change